Ilovealphacool
New member
Hello!
I recently bought the Alphacool Core DDR5-RAM module, and G.Skill 64GB 6000MHz CL28 Trident Z5 Neo RGB.
Yesterday I put the RAM in isopropanol alcohol 99% and this morning the original heatsinks came off very easily.
When trying to assemble the RAM module, I cant fully screw it in, because the IC on one side of the naked RAM PCB is touching the Alphacool heatsink.
I first tried to put the 0.5 mm thermal pads included, according to the instructions, but this caused an air gap between the PCB and heatsink since the IC was very much preventing closing of the module (the modules were very angled due to the IC sticking out), see image below.

After some measurements with different thicknesses, it seems to me that the total thickness that can fit for the RAM module and the RAM that I have, is total of 0.2mm.
In other words, if I were to put 0.1 mm thermal pad on the PCB, on both sides, then I could I probably screw in the RAM module completely.
But from what I understand, 0.1 mm is not recommended since this is very thin.
Any advice or guidance you can provide is greatly appreciated!
The image below shows how the original G-skill heatsink was designed (they cut out a part for where the IC is).

I recently bought the Alphacool Core DDR5-RAM module, and G.Skill 64GB 6000MHz CL28 Trident Z5 Neo RGB.
Yesterday I put the RAM in isopropanol alcohol 99% and this morning the original heatsinks came off very easily.
When trying to assemble the RAM module, I cant fully screw it in, because the IC on one side of the naked RAM PCB is touching the Alphacool heatsink.
I first tried to put the 0.5 mm thermal pads included, according to the instructions, but this caused an air gap between the PCB and heatsink since the IC was very much preventing closing of the module (the modules were very angled due to the IC sticking out), see image below.

After some measurements with different thicknesses, it seems to me that the total thickness that can fit for the RAM module and the RAM that I have, is total of 0.2mm.
In other words, if I were to put 0.1 mm thermal pad on the PCB, on both sides, then I could I probably screw in the RAM module completely.
But from what I understand, 0.1 mm is not recommended since this is very thin.
Any advice or guidance you can provide is greatly appreciated!
The image below shows how the original G-skill heatsink was designed (they cut out a part for where the IC is).
