More holes are needed to dissipate hot heat.

[william kim]

I conducted various tests with the ES 2U chassis. When all cores of the W5-3565x CPU were set to 4.8Ghz and full stress was tested, the CPU temperature was close to 99 ~101 degrees.

During various tests, it was concluded that more holes were need for air to enter and exit.

The new ES 2U chassis should be released with an additional hole in the top cover and rear side to make it easier for cold air to be drawn in and hot air to be released.

This will lower the temperature by up to 3 degrees or more.

 

[Eddy]

Holes in the top make no sense, as the next housing is usually positioned directly above it. What is used for cooling here? Air cooling?
Wanting to cool a CPU with over 330W TDP with a 1U air cooler is also very bold. Especially as I am not aware of a single 1U air cooler that is officially designed for more than 250W TDP. What kind of cooler are you using?

Incidentally, slots on the top make no sense, as at least our server customers fill up their cabinets. So there would be no space for an airflow to the top.

 

[petersmith]

You're absolutely right! Adding more holes can improve heat dissipation. This will help the system cool down more efficiently. If you're looking for better airflow, consider a as well to enhance the overall cooling performance.