While this may be part of the issue, that fact that only the upper middle (more like top middle) lacked paste as opposed to all of the die or even just the middle of the die suggests that there was an uneven contact problem too.Ok, sounds like the same mistake as most people here. Apparently, this chiplet design causes the problem that with "normal" thermal pastes (NH-2, MX4, etc.) a "pump out" effect is created, i.e. the paste may become too liquid and run off between the chips.
Kryosheet solved it. Maximum temperature I could get while using cyberpunk and RDR was 76C. Put clapton tape all around the die and used drops of thermal paste on the corners to help keep the kryosheet in place. Just a note for other ogres like me planning to do this: careful that this sheet tears very easily. Thanks @DirtyAlpaca and others in this thread!Registered just to mention it seems I have the same issue with the Nitro+ version of the waterblock. I've used the same loop for a 2080ti and 6900xt and thought I needed to upgrade the pump and radiator (previously 1x 280 radiator, now 2x 280 ones) but the result is pretty much the same: junction temperature over 100C, hitting 110C on cyberpunk's benchmark, but with older games it stays under 60C (probably wouldn't even notice there was a problem if I didn't install cyberpunk just to see how the RT support is doing on linux). Bought a torque screwdriver and both the Kryosheet (have clapton tape) and PTM (in case I don't manage to get the Kryosheet in place) to give it a try and will report the results.
Thanks for the input! Which thermal pads did you use?I can also broadly agree with dcox12's statement.
If you have experience with liquid metal, there is nothing to say against it. When it comes to the chiplet design and usage, I haven't come across much on the internet.
I use the cryosheet on my Merc310. Yes, it is more expensive, but it will never dry out, i.e. “maintenance-free”.
As I described above, not easy to place, but great results and no more problems.
I replaced the thermal pads straight away.
And this could be the point where things went wrong.I've now tried to make sure the PCB is even, I Screwed the 4 screws around the GPU-Chip handtight and then one turn outward to have even pressure around the die.
Okay, i think i'll give that a try, although i tried to change the pressure of the 4 screws around the PCB while it was running (which i know you schouldn't do) and decreasing the pressure on these screws lowered the hotspot temperature. Also the backplate contributes quite a bit to the temperatures as well, without it was at 105°C and with backplate at 95°C.Long story short: If using PTM, screw it thight. That worked very well for me.